HP | HPQ - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
3D Systems 1.96M 36K 2025-12
Accenture USD 70.64M 7.08M 2026-03
Advanced Micro Devices USD 37M 0 2026-06
Amphenol USD 213.7M 5.8M 2026-06
Apple USD 377M 98M 2025-09
Applied Materials USD 168M 99M 2026-06
Arista Networks USD 110.8M 25.8M 2026-03
Broadcom USD 703M 104M 2026-06
Canon JPY 2.29B 263M 2025-12
CDW USD 58.5M 3.5M 2025-12
Ciena USD 5.8M 15.12M 2026-06
Cisco Systems USD 373M 4M 2026-06
CommScope USD 153.1M 17.8M 2025-12
Corning USD 94M 2M 2026-06
F5 Networks USD 6.83B 331.6M 2026-06
Hewlett Packard USD 75M 26M 2026-06
HP USD 98M 1000K 2026-03
IBM USD 473M 5M 2026-03
Intel USD 264M 19M 2026-03
Jabil Circuit USD 63M 5M 2025-09
KLA Corporation USD 73.27M 2.85M 2026-06
Lam Research USD 39.33M 1.54M 2026-03
Lenovo USD 89.01M 69.62M 2026-06
Micron Technology USD 32M 42M 2025-12
Microsoft USD 778M 42M 2026-03
Motorola Solutions Msi USD 111M 6M 2026-03
NCR USD 15M 1000K 2026-06
NetApp USD 28M 7M 2026-03
Nvidia USD 227M 125M 2026-06
Oracle USD 1.43B 10M 2026-06
Qualcomm USD 178M 7M 2026-06
Ricoh JPY 1.93B 841M 2025-06
Sanmina USD 32.46M 326K 2026-06
Seagate Technology USD 68M 4M 2026-03
Seiko Epson JPY 2.58B 3.94B 2025-06
Sensata Technologies USD 32.8M 1.3M 2026-06
Stratasys 726K 1.58M 2024-06
SYNNEX USD 97.84M 9.84M 2026-03
TE Connectivity USD 31M 1000K 2026-06
Western Digital USD 38M 16M 2026-03
Xerox USD 31M 0 2024-12